PCB manufacturing
We provide customers with one-stop PCB solutions, specializing in the research and development, production, and sales of rigid multilayer circuit boards (MLB), high-density circuit boards (HDI), flexible circuit boards and mounting (FPC&FPCA), rigid flexible junction boards (R-F), and carrier boards (ICSubstrate). We are a key high-tech enterprise in the national Torch Program, a vice chairman unit of the China Electronics Circuit Industry Association (CPCA), and one of the CPCA industry standard setting units. We are an advanced level agent in industry technology and product quality in China.
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One-stop PCB solution
Hard board MLB, HDI, HLC Soft board FPC, FPCA, RF carrier board
Smart manufacturing
Efficient automated production line design and introduction of MES, EAP, QMS, CRM and other information systems
Full Service
Pre-sales R&D technical support, rapid response to after-sales service, global service base layout
Delicate management
Product traceability management, formula release and production TPM, TQM
Technology Roadmap
High Layer Count
| Technical characteristics | 2024 | 2025 | 2026 | ||||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Max. Layer Counts (Layers) | 36 | 48 | 40 | 52 | 44 | 56 | |
| Max. board thickness (mm) | 6 | 10 | 6 | 10 | 6 | 10 | |
| Min. board thickness (mm) | 0.5 | 0.4 | 0.4 | 0.3 | 0.4 | 0.3 | |
| Shipment size (mm) | 710*1250 | 710*1250 | 710*1250 | 710*1250 | 710*1250 | 710*1250 | |
| Min. BGA pitch (mil） | 20 | 16 | 16 | 16 | 16 | 16 | |
| Registration in Same Core (mil) | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | |
| Registration in Adjacent Core (mil) | 2 | 1.2 | 1.6 | 1.2 | 1.6 | 1.2 | |
| Overall Registration (mil) | 4 | 3.5 | 4 | 3 | 4 | 3 | |
| Min. Drill Size (D) / Pad size (D+X): (mil) | D+7 | D+6 | D+7 | D+6 | D+7 | D+6 | |
| Drill | Min. Drilling Size (mm) | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 |
| Min. Laser Drilling Size (mm) | 0.1 | 0.075 | 0.075 | 0.075 | 0.075 | 0.075 | |
| Aspect Ratio | Drilling Size 0.15mm | 16:1 | 18:1 | 16:1 | 18:1 | 16:1 | 18:1 |
| Drilling Size 0.2mm | 20:1 | 23:1 | 20:1 | 25:1 | 20:1 | 25:1 | |
| Drilling Size 0.25mm | 20:1 | 25:1 | 22:1 | 25:1 | 22:1 | 25:1 | |
| Laser Drilling Size 0.2mm | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | |
| Laser Drilling Size 0.075mm | 0.8:1 | 1:1 | 0.8:1 | 1:1 | 0.8:1 | 1:1 | |
| Impedance tolerance | Inner Layer | ±7% | ±5% | ±6% | ±5% | ±6% | ±5% |
| Outer Layer | ±8% | ±8% | ±8% | ±7% | ±8% | ±7% | |
| Min. inner linewidth/space | 1/2oz Cu: (mil) | 3/3 | 2.5/2.5 | 2.5/2.5 | 2.0/2.0 | 2.0/2.0 | 1.6/1.6 |
| 1oz Cu: (mil) | 3/3.5 | 3/3 | 2.8/3.2 | 2.5/3 | 2.8/3.2 | 2.5/3 | |
| 2oz Cu: (mil) | 5/5 | 4.5/5 | 4.5/5 | 4/4.5 | 4.5/5 | 4/4.5 | |
| Min. outer linewidth/space | 1/3 OZ+Plating:(mil) | 3/3 | 2.5/3 | 2.5/2.5 | 2.5/2.5 | 2/2.5 | 2/2.5 |
| 1/2 OZ+Plating:(mil) | 3/3.5 | 3/3.2 | 3/3.2 | 2.8/3 | 2.8/3 | 2.8/3 | |
| 1/3 OZ+Plating (POFV):(mil) | 3.2/3 | 3/3 | 2.8/3 | 2.5/2.8 | 2.5/3 | 2.5/3 | |
| 1/2 OZ+Plating (POFV):(mil) | 3.5/3.5 | 3.2/3.5 | 3/3.5 | 3/3.2 | 3/3 | 3/3 | |
| Vacuum resin plughole | Min. hole size (mil) | 7.9 | 5.9 | 7.9 | 5.9 | 7.9 | 5.9 |
| AR @ 7.9 mil hole | 23:1 | 25:1 | 25:1 | 25:1 | 25:1 | 25:1 | |
| Solder mask | Registration (mil) | ±1.2 | ±1.0 | ±1.2 | ±1.0 | ±1.2 | ±1.0 |
| Min. SM dam width (mil) | 2.8 | 2.5 | 2.8 | 2.5 | 2.8 | 2.5 | |
| SM plugging AR | 14:1 | 16:1 | 14:1 | 16:1 | 14:1 | 16:1 | |
| Back drill | Hole to copper(mil) | 5.0 | 4.5 | 5.0 | 4.5 | 5.0 | 4.5 |
| Stub length(mil) | 6±4 | 4±2 | 5±3 | 4±2 | 4±2 | 4±2 | |
| Min. core thickness (mil) | 2 | 2 | 2 | 2 | 2 | 2 | |
| Min & max copper thickness (OZ) | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | |
| Min. press fit hole tolerance (mil) | ±2.0 | ±1.8 | ±1.8 | ±1.8 | ±1.8 | ±1.8 | |
| Surface finish | ENIG,ENIG+OSP, Immersion Sn/Ag, G/F+OSP,G/F+ENIG, ENEPIG | ||||||
HDI
| Technical characteristics | unit | 2024 | 2025 | 2026 | |||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Layers | / | 12 | 14 | 12 | 14 | 12 | 14 |
| Board structure | / | 3+n+3 | AnyLayer(12) | AnyLayer(12) | AnyLayer(14) | AnyLayer(12) | AnyLayer(14) |
| Min. board thickness（10L） | mm | 0.65 | 0.6 | 0.6 | 0.55 | 0.6 | 0.55 |
| Min. dielectric thickness | mm | 0.040（1037） | 0.035（1027） | 0.035（1027） | 0.025（1017） | 0.03 | 0.025 |
| Bow & Twist | / | ≤0.5% | ≤0.4% | ≤0.5% | ≤0.4% | ≤0.5% | ≤0.4% |
| Min. line width / spacing of inner layer | um | 40 / 50（whole） | 40 / 40（Part） | 40 / 40（whole） | 35 / 50（whole） | 35 / 40（whole）mSAP | 30 / 30（Part）mSAP |
| Min. line width / spacing of outerlayer | um | 50 / 50（whole） | 40 / 50（Part） | 40 / 50（whole） | 40 / 40（whole） | 40 / 40（whole）mSAP | 35 / 40（Part）mSAP |
| Min. BGA pitch | mm | 0.325 | 0.30 | 0.325 | 0.30 | 0.325 | 0.30 |
| Min. via size | um | 75 | 65 | 65 | 60 | 65 | 55 |
| Min. landing PAD size | um | D+150 | D+100 | D+125 | D+100 | D+125 | D+100 |
| Via hole aspect ratio | / | 0.8:1 | 1:1 | 0.8:1 | 1:1 | 0.8:1 | 1:1 |
| Impedance capability（＞50Ω） | ohm | +/- 10% | +/- 8% | +/- 10% | +/- 8% | +/- 8% | +/- 7% |
| Impedance capability（≤50Ω） | ohm | +/- 5ohm | +/- 4ohm | +/- 5ohm | +/- 4ohm | +/- 5ohm | +/- 4ohm |
| Solder mask registration | um | ± 25 | ± 20 | ± 25 | ± 20 | ± 25 | ± 20 |
| Min. solder mask dam | mm | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Min. through hole size | mm | 0.2 | 0.15 | 0.2 | 0.15 | 0.2 | 0.15 |
| Molding processing | mm | +/-0.1 | +/-0.075 | +/-0.1 | +/-0.075 | +/-0.075 | +/-0.05 |
R-F
| Technical characteristics | unit | 2024 | 2025 | 2026 | |||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Dielectric thickness(FPC) | mm | 0.025~0.15 | 0.025~0.15 | 0.025~0.15 | 0.013~0.15 | 0.013~0.15 | 0.013~0.15 |
| Surface roughness | um | 50 | 50 | 50 | 30 | 50 | 30 |
| Min distance from the hole tothe Window | mm | 0.5 | 0.4 | 0.5 | 0.4 | 0.4 | 0.4 |
| Min distance from copper towindow | mm | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Window glue overflow | mm | 0.5 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
| Window min width | mm | 3.5 | 3.0 | 3.0 | 2.6 | 2.6 | 2.6 |
| Flex board finished copperthickness | OZ | 1/2-2 | 1/2-2 | 1/3-2 | 1/3-2 | 1/3-2 | 1/3-2 |
| Rigid board finish copperthickness | OZ | 1/2-4 | 1/3-4 | 1/3-4 | 1/3-4 | 1/3-4 | 1/3-4 |
| Min line width /space | mm | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.04/0.04 |
| Min board thickness | mm | 0.35 | 0.3 | 0.3 | 0.25 | 0.25 | 0.25 |
| Impedance capability | % | ±8 | ±7 | ±8 | ±7 | ±7 | ±5 |
| Bend control | % | ≤0.75 | ≤0.50 | ≤0.75 | ≤0.50 | ≤0.50 | ≤0.50 |
| Min completed PTH aperture | mm | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 | 0.10 |
| Control depth tolerance | mm | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 |
| HDI Type RF Laser Order | / | 3 Step | 4 Step | 3 Step | 4 Step | 4 Step | Anylayer |
| Number of soft boards in RF(hinge type) | / | ≤4 | ≤6 | ≤6 | ≤8 | ≤8 | ≤10 |
| Number of soft boards in RF(bonding) | / | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 |
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